Apple’s highly anticipated foldable iPhone has been the subject of widespread speculation for years. While the Cupertino-based tech giant has yet to make an official announcement, a series of fresh leaks suggest the company is making significant strides in its development. The latest reports indicate that Apple is focusing on a thinner, more power-efficient device with a premium build, aiming to set a new benchmark in the foldable smartphone segment. Slimmer Foldable iPhone in Works
According to a report from Korean news aggregator yeux1122, Apple is prioritizing a slimmer design for its first foldable handset. The company is reportedly improving the display driver IC (DDI) components to reduce overall thickness. If these reports hold true, the foldable iPhone will measure only 4.5mm when unfolded and between 9mm and 9.5mm when folded, potentially making it the thinnest foldable smartphone on the market. This ultra-thin profile may come at the expense of some familiar Apple features. Leaks suggest that Apple could forgo Face ID in favor of a Touch ID sensor embedded in the power button, a move aimed at conserving internal space. Additionally, the device is expected to sport a titanium chassis, enhancing both durability and aesthetics. Design and Display
Industry analysts, including Ming-Chi Kuo and Jeff Pu, along with renowned tipster Digital Chat Station, suggest that Apple has finalized key hardware aspects of its foldable iPhone. The device is expected to feature a 7.8-inch primary display when unfolded, alongside a 5.5-inch cover screen for use when the device is closed. Unlike clamshell foldables such as the Galaxy Z Flip, Apple’s foldable iPhone is expected to adopt a book-style design, similar to the Samsung Galaxy Z Fold series. This means the device will open horizontally, transforming into a near-tablet-sized display when unfolded, catering to users who prioritize multitasking and a larger screen experience. Revolutionizing Durability with Liquid Metal Hinges
One of the most significant concerns surrounding foldable devices has been durability, particularly hinge longevity and screen creasing. To tackle these issues, Apple is reportedly incorporating liquid metal into the hinge mechanism. Liquid metal, known for its strength and flexibility, has previously been used in smaller Apple components, such as SIM ejector pins. Now, it is set to play a crucial role in enhancing the durability and smoothness of the folding mechanism. Reports suggest that Dongguan EonTec will be the exclusive supplier of this material for
